Laser cutting

Below you will find an overview of the design guidelines, quality standards and test methods used in the processing of Al₂O₃ substrates.

In addition to our standard substrates, we also process ceramics with thicknesses between 0.09 and 2.0 mm and maximum dimensions of 350×350 mm². CO₂ laser sources are used as standard. Laser processing is independent of the substrate shaping process.

The following document shows an overview of the different laser processing options for thickfilm alumina substrates. In addition, the layout can be aligned by camera systems using the edges of the raw material, register/print marks or similar objects.