ATS

ATS was primarily developed for thinfilm applications, especially as a carrier material for platinum thinfilm sensors such as Pt100, and can be easily cut or structured by using a laser or wafer saw. Due to its inner mechanical strength and fine grains, this material causes far less material chipping at the production edges during the manufacturing process compared to other common materials. Due to the very fine grains of ATS, very fine platinum structures with correspondingly good resistances are possible. Try it out for yourself.

We cut the material according to your wishes using lasers. Please send us your CAD data.